Facilities & Equipements
Micro & NanoTechnology Equipements
The PTA provides you with state-of-the-art equipment to support your most ambitious nanoscience and micro-nanotechnology projects. Our specialized facilities, incorporating advanced systems for lithography, deposition and etching, enable ultra-precise integration of nano-objects and nanomaterials, as well as the shaping of ultra-thin nanoscale layers.
Designed for optimum flexibility, our infrastructure can handle a wide range of substrates, from small 5 × 5 mm² samples to 100 mm wafers, and up to 200mm wafers capabilty in several tools. All our processes are carried out under strict contamination control conditions, guaranteeing reliable, high-quality results.
Optical, Laser and E-beam Lithography
- E-beam Lithography Tool (JEOL 6300FS)
- Nanoimprint Lithography UV&Thermal (Obducat Eitre 6)
- Direct Write Laser Lithography (Heidelberg µPG 101)
- Mask Aligner (Karl Suss MJB4 UV)
- Mask Aligner (Karl Suss MJB4 DUV)
- Mask Aligner – Double Face – (Suss Microtec MA8 UV) + NanoImprint Module
- Maskless Lithography Projection (SmartPrint MicroLight 3D)
- UltraSonic Spray Coating (OSIRIS VARIXX 804)
- Coater and hotplates for substrates up to 200 mm (SPS)
(Thin) Film Deposition and Material Growth
- Multi-target PVD magnetic multilayers Co|Co40Fe40B20|Co70Fe30|Fe60Co20B20|Ir20Mn80|Ni80Fe20|Cr|Al|Cu|Mg|MgO|Pt|Ru|Ta|W|Ni|Ti|Mo|Nb (Singulus)
- Multi-target PVD magnetic multilayers Al|Mg|Cu|Ta|W|Ru|Pt|Co|FeCoB|Ni80Fe20|IrMn|Tb (Actenium)
- Multi-target confocal sputtering tool Co|Co35Fe35B30|Co60Fe20B20|Cr|Fe|Mn|Ir20Mn80|Fe50Mn50|Ta|Si|Ru|Sn|W|Al|Cu|Ge|MgO|Nb|Ni|Pt|Gd|Ir|Mg|Pd (Convergence)
- Multi-target Metallization PVD Cr|Cu|W|Ta|TiN|TiO2|Ti|Au|Nb (Plassys)
- Multi-target Oxide&Metallization PVD Ti|Al|Ta|Nb|TiN|AlN|NbN|SiOx|SiNx|ITO|NiFe (Alliance Concept)
- Electron Beam Evaporation Ti|Cr|Al|Au|Cu|Ag|Co|Sn|NiCr|NiFe|CoFe|Co|T (Plassys) – Cryo Deposition
- Electron Beam Evaporation Ti|Cr|Au|Al|Ni|Pt|Ge|Pd|Nb|V (Plassys)
- ICPCVD SiO2|SiN|a-Si (Sentech)
- Atomic Layer Deposition Al2O3|TiO2|HfO2|ZrO2|ZnO|AZO (Cambridge Nanotech)
- Atomic Layer Deposition Al2O3|TiO2|HfO2|TiN|ZnO|AZO (Oxford)
- LPCVD Poly-Si (Tempress)
- PECVD SiOx|SiNx|a-Si (Corial)
Etching, Ashing and Micromachining
- ICP Inductive Coupled Plasma (Sentech)
- ICP Inductive Coupled Plasma (Oxford)
- IBE Ion Beam Etching (Plassys)
- IBE Ion Beam Etching (SCIA)
- IBE/IBD Ion Beam Etching & Depostion (SCIA)
- DRIE Deep Reactive Ion Etching (SPTS Rapier)
- HF Vapor (Primaxx)
- Plasma O2 Stripper (PlasmaTherm)
- Supercritical CO2 point dryer (Tousimis)
Advanced Packaging, Annealing and BackEnd Processes
- Rapid Thermal Annealing (Jetfirst100 JIPELEC)
- MEMs Dryer (Tousimis Automegasamdri 815B-C)
- Wafer Bonder (Karl Suss SB6)
- Chemical Mecanical Polishing (Alpsitec E460C)
- Electro Plating Cu|AgSn|FeNi (Biologic VSP-300)
- Dicing Saw (Disco 321)
- Dicing Saw (Disco 3361)
- Wafer Laser Dicing (PowerLine E 25 SHG ITX)
- Chip Ball Bonding (JPF WB200)
- Flip Chip Bonders (JPF PP6)
- Screen Printing Ag|Pt|Pd (ATMA AT25-PA)
- Wire Bonder Manual Al|Au (KS 23)
- Wire Bonder Automatic Al|Au (WB 200)
- Pick and place (JFP PP6)
Metrology, Caracterization and Wafer Inspection
- Scanning Electron Microscope (ZEISS Ultra+) – EDX (Xflash Detector 5030)
- Scanning Electron Microscope (ZEISS Ultra+)
- Profilometer (KLA P7)
- Profilometer (Dektak DXT E)
- Ellipsometer (HORIBA Auto SE)
- Manual microscopes for Optical Inspection
How to use Our Facilities
At PTA, our platform is designed to empower advanced micro- and nano-fabrication projects with flexible project management solutions.
Direct Access
Engineers, researchers, technicians, students, and industry professionals can independently operate our state‑of‑the‑art cleanroom tools and execute the essential process steps. This model provides full hands-on engagement with our cutting‑edge facilities, allowing you to control every phase of your project.
Subcontracted Service
Alternatively, you can leverage our PTA technical team to implement the defined technological steps in close coordination with your project manager. This approach enables you to capitalize on our specialized expertise while dedicating your focus to the strategic aspects of your research and development.
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PTA Grenoble
38054 Grenoble
Call Us
(33) 4 38 78 20 05